Copper
ALDRICH/266744 - foil, thickness 1.0 mm, 99.999% trace metals basis
CAS Number: 7440-50-8
Empirical Formula (Hill Notation): Cu
Molecular Weight: 63.55
EC Number: 231-159-6
MDL Number: MFCD00010965
Linear Formula: Cu
Product Type: Chemical
application(s) | battery manufacturing |
assay | 99.999% trace metals basis |
bp | 2567 °C (lit.) |
density | 8.94 g/mL at 25 °C (lit.) |
form | foil |
InChI | 1S/Cu |
InChI key | RYGMFSIKBFXOCR-UHFFFAOYSA |
mp | 1083.4 °C (lit.) |
Quality Level | 100 |
resistivity | 1.673 μΩ-cm, 20°C |
SMILES string | [Cu] |
thickness | 1.0 mm |
Application: | A corrosion resistant graphene reinforced composite coating was deposited on 1.0mm thick copper foil by electrophoretic deposition. |
General description: | Copper exhibits excellent thermal and electrical conductivities along with high malleability. |
Packaging: | 1 ea in rigid mailer |
Packaging: | 11 g in rigid mailer |
Quantity: | 25×50 mm (approximately 11 g) |
Risk Statements | 53 |
RIDADR | UN 3077 9 / PGIII |
WGK Germany | WGK 2 |
Flash Point(F) | Not applicable |
Flash Point(C) | Not applicable |
Purity | 99.999% trace metals basis |
bp | 2567 °C (lit.) |
mp | 1083.4 °C (lit.) |
Density | 8.94 g/mL at 25 °C (lit.) |
UNSPSC | 12141711 |