Gold coated silicon wafer
ALDRICH/643262 - 99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)
Synonym: gold coated silicon; gold coated wafer
Empirical Formula (Hill Notation): Au
Molecular Weight: 196.97
MDL Number: MFCD00003436
Linear Formula: Au
Product Type: Chemical
| assay | 99.99% (Ti) |
| 99.999% (Au) | |
| diam. × thickness | 4 in. × 500 μm |
| InChI | 1S/Au |
| InChI key | PCHJSUWPFVWCPO-UHFFFAOYSA |
| layer thickness | 1000 Å |
| matrix attachment | Titanium, as adhesion layer used to bind the gold to the silicon wafer. |
| SMILES string | [Au] |
| Application: | Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning. |
| General description: | Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer. |
| General description: | The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer. |
| Packaging: | 1 ea in padded box |
| Packaging: | Packaging 1 set in single wafer shipper |
| RIDADR | NONH for all modes of transport |
| WGK Germany | WGK 3 |
| Flash Point(F) | Not applicable |
| Flash Point(C) | Not applicable |
| Purity | 99.99% (Ti); 99.999% (Au) |
| UNSPSC | 12352103 |