Negative photoresist I
ALDRICH/651796
CAS Number: 9003-31-0
MDL Number: MFCD00084438
Product Type: Chemical
λmax | 310-480 nm |
bp | 122-142 °C (lit.) |
composition | solids, 27-29 wt. % |
density | 0.89 g/mL at 25 °C (lit.) |
dielectric constant | 2.4 |
InChI | 1S/C14H28O2/c1-4-5-6-7-8- |
InChI key | UBZVSDZJBLSIJG-UHFFFAOYSA |
mol wt | average Mw 60,000-70,000 (polyisoprene) |
storage temp. | 2-8°C |
surface tension | 29.2 dyn/cm |
viscosity | 465-535 cP(25 °C) |
General description: | A stabilized, purified photoresist which exhibits superior resolution, adhesion, etch resistance and low pinhole density. |
General description: | Available as part of Negative Photoresist kit 654892 |
Packaging: | 100 mL in glass bottle |
Symbol | GHS02,GHS07,GHS08 |
Signal word | Danger |
Hazard statements | H226 - H304 - H312 + H332 - H315 - H335 - H360FD - H412 |
Precautionary statements | P210 - P273 - P280 - P301 + P310 - P303 + P361 + P353 - P331 |
Hazard Codes | T |
Risk Statements | 60-61-10-20/21-36/37/38-52/53-65 |
Safety Statements | 53-26-35-36/37-61-62 |
RIDADR | UN1307 - class 3 - PG 3 - Xylenes, solution |
WGK Germany | WGK 3 |
Flash Point(F) | 75.2 °F - closed cup |
Flash Point(C) | 24 °C - closed cup |
bp | 122-142 °C (lit.) |
Density | 0.89 g/mL at 25 °C (lit.) |
Storage Temp. | 2-8°C |
UNSPSC | 41116107 |