Nickel
ALDRICH/767484 - sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
CAS Number: 7440-02-0
Empirical Formula (Hill Notation): Ni
Molecular Weight: 58.69
EC Number: 231-111-4
MDL Number: MFCD00011137
Linear Formula: Ni
Product Type: Chemical
| assay | 99.95% trace metals basis |
| bp | 2732 °C (lit.) |
| density | 8.9 g/mL at 25 °C (lit.) |
| diam. × thickness | 2.00 in. × 0.25 in. |
| form | solid |
| InChI | 1S/Ni |
| InChI key | PXHVJJICTQNCMI-UHFFFAOYSA |
| mp | 1453 °C (lit.) |
| Quality Level | 100  |
| reaction suitability | core: nickel |
| resistivity | 6.97 μΩ-cm, 20°C |
| SMILES string | [Ni] |
| Application: | Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition. |
| Packaging: | 1 ea in rigid mailer |
| Symbol |   GHS07,GHS08 |
| Signal word | Danger |
| Hazard statements | H317 - H351 - H372 |
| Precautionary statements | P201 - P280 - P302 + P352 - P308 + P313 |
| Hazard Codes | T |
| Risk Statements | 40-43-48/23-52/53 |
| Safety Statements | 36/37/39-45-61 |
| RIDADR | NONH for all modes of transport |
| WGK Germany | WGK 2 |
| Flash Point(F) | Not applicable |
| Flash Point(C) | Not applicable |
| Purity | 99.95% trace metals basis |
| bp | 2732 °C (lit.) |
| mp | 1453 °C (lit.) |
| Density | 8.9 g/mL at 25 °C (lit.) |
| UNSPSC | 11101706 |