High speed bright copper electroplating solution

ALDRICH/900569 - semiconductor grade

Synonym: Fast Copper Electroplating Solution

Product Type: Chemical

Catalog Number	PKG Qty.	Price	Quantity


45-900569-500ML	500 mL	No Price

Properties
Descriptions
Safety Info.
Basic Data

concentration	40 mg/L±4 mg/L chloride
	600 mg/L±60 mg/L (organic additives)
	65.0 g/L±2 g/L Cu
	8.0 g/L±0.4 g/L H₂SO₄
form	liquid
grade	semiconductor grade
Quality Level	100

Application:	Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives.: This study presents advancements in high-speed copper electroplating technologies, focusing on the application of compound additives to enhance copper-filling performance for microelectronic interconnections. The research demonstrates significant improvements in deposition rates and uniformity, essential for manufacturing high-performance energy storage systems and batteries. This aligns with industrial and academic interests in developing more efficient and eco-friendly copper plating processes for electronic components (Wang Q et al., 2022 ).
Features and Benefits:	• The use of single electroplating solution containing plating additives. • Stable additives with large process window. • High purity electrolyte and long shelf life. • High cloud point (>80 °C) and low foaming. • Low surface tension plating bath (∼44 dyne/cm @ 25 °C). • High speed plating (Up to 5 μm/min). • Uniform and flat bumps, pads, patterns and redistributions layers. • Void free filling of vials and trenches.
General description:	High speed bright copper electroplating solution is an electrolytic acid copper process engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vials and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. This copper electroplating solution is made up of cupric sulphate and sulphuric acid with small additions of hydrochloric acid and organic additives. The organic additives have a wide concentration process window eliminating the need for separate additive solutions and replenishment for about 120 Amp-hours of electroplating.
Packaging:	500 mL in poly bottle
Quality:	Deposits characteristics: • Density of 8.9 g/cm³. • Electrical resistivity of 1.7–1.8 μΩ cm. • Stress <50 MPa. • High in-film purity (<10 ppm for N, S, C, O, Cl). • Low surface roughness, RMS <10 nm @ 1 μm thick Cu. • Planarization of trenches (no recess in 1 μm wide x 0.5 μm deep trenches with 0.8 μm thick Cu). • Strong (111) texture with small (220) and (200). • Reflectivity >75%. • Elongation of 19–32%.

Symbol	GHS05,GHS07,GHS09
Signal word	Warning
Hazard statements	H290 - H302 - H315 - H319 - H410
Precautionary statements	P273 - P301 + P312 + P330 - P302 + P352 - P305 + P351 + P338
RIDADR	UN 3264 8 / PGII
WGK Germany	WGK 3
Flash Point(F)	Not applicable
Flash Point(C)	Not applicable

UNSPSC

12352103

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