Nickel electroplating solution
ALDRICH/901823
Synonym: Ni electroplating solution; Ni plating solution
Product Type: Chemical
| composition | 170g/L ±5 g/L Ni(SO3NH2)2.4H2O |
| 30 g/L ±0.5 g/L H3BO3 | |
| 9.51 g/L ±1 g/L NiBr2 .xH2O | |
| contains | 0.015 g/L±0.0015 g/L wetting agent |
| 1.25 g/L±0.125 g/L stabilizer | |
| 4.25 g/L±0.25 g/L Stress reducer | |
| form | liquid |
| Features and Benefits: | • Deposits have low internal stress and are very ductile. • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity. • As plated Ni films have small grains in the range of 10 - 50 nm. Grain size orientations are (111) and (200) for FCC (face centred cubic). • Qualified bath metrology for replenishment and a long shelf life. Electroplated Ni film (5-10 μm thickness) properties: • Density: 8.1 g/cm3 • Young′s modulus: 210 GPa • Internal stress 33 ± 13 MPa • Tensile strength: 585 ± 40 MPa • Grain size: 10-50 nm |
| General description: | Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films. |
| Symbol |    GHS05,GHS08,GHS09 |
| Signal word | Danger |
| Hazard statements | H317 - H318 - H334 - H341 - H350 - H360D - H372 - H410 |
| Precautionary statements | P202 - P273 - P280 - P302 + P352 - P305 + P351 + P338 - P308 + P313 |
| RIDADR | UN 3082 9 / PGIII |
| WGK Germany | WGK 3 |
| Flash Point(F) | Not applicable |
| Flash Point(C) | Not applicable |
| UNSPSC | 12352303 |