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aldrich Brand

Displaying 12801-12850 of 68619 results.
Sigma Cat.No.Description
6466791,1,2-Trimethyl-3-(4-sulfobutyl)benz[e]indolium, inner salt
Dye content 90 %
646687Silicon
wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
6467335-Amino-3-(4-bromophenyl)pyrazole
97%
6468302-Pyrimidinecarbonitrile
97%
64685Methoxyacetaldehyde dimethyl acetal
≥98.0% (GC)
646938N-(4-Pentynyl)phthalimide
97%
6469624-Amino-3-nitropyridine
97%
6469896-Bromopyridine-3-carboxylic acid
96%
6470042-Iodo-5-nitropyridine
97%
6470554,4-Diethoxy-N,N-dimethyl-1-butanamine
647063Poly((4,4′-carbonylbis(1,2-benzenedicarboxylic acid))-alt-(4,4′-methylenedianiline)
~18 wt. % in solution
647098Phenylboronic acid pinacol ester
97%
647101Silicon
wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
6471365-(4-Formylphenyl)pyrimidine
97%
6471875-Bromophthalide
97%
6471955-Cyanophthalide
97%
6472094-(Diphenylamino)benzaldehyde
97%
6472924-(Diphenylamino)phenylboronic acid
≥95%
6473732,3-Dibromobenzo[b]thiophene
97%
6473817-Chloro-4-iodoquinoline
97%
647446(S)-(−)-2-Aminomethyl-1-ethylpyrrolidine
96%
647535Silicon
wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
647543Silicon
wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
647594Methyl 4-bromo-2-methoxybenzoate
98%
647604-Methoxyazobenzene
≥98.0%
6476084-Hydroxy-3-methoxy-α-methylbenzyl alcohol
97%
647616Methyl 4-amino-2-methoxybenzoate
97%
6476244-Amino-2-methoxybenzoic acid
97%
647640Zirconium(IV) chloride
powder, 99.99% trace metals basis
647659Acetophenone oxime
95%
647675Silicon
wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.5 mm
647705Silicon
wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm
6477561-Acetylpiperidine-4-carboxylic acid
97%
647764Silicon
wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
647772Silicon
wafer (single side polished), <111>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
647780Silicon
wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam. × thickness 2 in. × 0.5 mm
647799Silicon
wafer (single side polished), contains phosphorus as dopant, <111>, N-type, diam. × thickness 2 in. × 0.5 mm
647802Silicon
wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam. × thickness 3 in. × 0.5 mm
647829PAMAM dendrimer, cystamine core, generation 2.0 solution
20 wt. % in methanol
648116Methyl 3-(bromomethyl)benzoate
97%
648159PAMAM dendrimer, cystamine core, generation 5, solution
10 wt. % in methanol
648418(−)-DIP-Chloride solution
50-65 wt. % in heptane
6484341-Methyl-3-phenylpiperazine
97%
648574Sulfur-34S
99 atom % 34S
6486122′-Deoxycytidine-13C9,15N3 5′-monophosphate disodium salt
≥98 atom %, ≥95% (CP)
6486202′-Deoxyadenosine-13C10,15N5 5′-monophosphate disodium salt
≥98 atom %, ≥95% (CP)
6486392,4-Pentanedione, polymer-bound
100-200 mesh particle size, extent of labeling: 2.5-3.5 mmol/g O loading, 2 % cross-linked with divinylbenzene
648663Bis(ethylcyclopentadienyl)ruthenium(II)
6487014-(2-Aminoethyl)pyridine
96%
648787Isopropylboronic acid
≥95%

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